Design Linked Initiative

Figure 1: No Copyright Infringement Intended

Context

• Recently, Government is seeking applications from startups and MSME for design linked initiatives.

About Design Linked initiatives:

• Announced by MeitY in December 2021.
• As part of this, financial incentives and design infrastructure support for domestic companies, start-ups and MSMEs at various stages of developing and deploying semiconductor designs for integrated circuits (ICs), chipsets and system-on-chips (SoCs) will be provided.
• Systems and IP cores have extended Semiconductor Linked Design for over five years.

Objective:

• To create a vibrant semiconductor chip design ecosystem in the country.
• Promote domestic manufacturing of semiconductors and related equipment.
• The program aims to provide companies in the semiconductor and display manufacturing and design industries with a globally competitive incentive package.

Implementation:

• The Center for Development of Advanced Computing (CDAC), a scientific society operated under MeitY, acts as a node agency for the implementation of DLI schemes.

Components:

• There are three components Chip design infrastructure support:
  • As part of this, CDAC has established the India Chip Center to host and provide state-of-the-art design infrastructure (ie, EDA tools, IP cores, MPW (multi-project wafer manufacturing) and post-silicon verification support).
  • Easier access to supported enterprises.
  • Incentives related to product design: Under this program, approved applicants involved in semiconductor design are eligible for a refund of up to 50% of eligible expenses, subject to a maximum of 15 chlores per application.

Mission-related incentives:

• These include approved applicants whose semiconductor designs for integrated circuits (ICs), chipsets, system-on-chip (SoC), system & IP cores, and semiconductor link designs are used in electronic products.